Detailed technological skill

Cibel is the specialist for the printed circuits manufacturing. We, of course, answer your technical requests, but more than this, based on our 25years experience, we systematically analyse the different elements of your project in order to identify risks and non optimized features. Coming back to you with proposals, we think about manufacturing reliability/repeatability and cost optimisation.

Rigid circuits

  • Single face, Dual faces
  • Multi-layers
  • Sequential build-up
  • Material :
    • FR4
    • FR4 HTg
    • Polyimid (including Kapton)
    • BT epoxy
    • " RF " Substrats (including RO3‚...,RO4‚...,N4000, Cuclad, Diclad, TMM‚... ,Duroïd)
  • Mixed substrates (Example : FR4HTG + RO4350)
  • RF circuits w/wo copper cladding

 

Flexi rigid circuits 

  • For applications inducing different levels.
  • Dimensions are identical to the rigid ones for the same finishes

 

 

Flexible circuits 

  • Single or dual faces : KAPTON PYRALUX/DUPONT material.
  • Main use : Interconnection as carrier for RF contact.

 

 

Dimensions and etching 

  • Rigid circuits dimensions 675x550 mm max
  • Overall thickness 6.4mm
  • Number of layers +40max
  • Traces thickness 5, 9, 18, 35, 70, 105, 210,400 µm
  • Minimum trace and gap widths on external layers : 60 µm locally
  • Minimum trace and gap widths on internal layers : 50 µm locally

Circuits finishes

  • Tin-Lead (not ROHS)
  • HAL SN100C
  • Electroless tin
  • Electrolytic Nickel with hard Gold : Ni 5 to 10 µm Au : 0,1 to 1,5 µm
  • Electroless Nickel Immersion Gold (ENIG) : Ni 4 to 7 µm Au <0,1 µm
  • Electroless Nickel Electroless Palladium Immersion Gold (ENEPIG) : Ni 4 to 7 µm, Pd < 0,15µm, Au < 0,05µm
  • Nickel Gold bonding : Ni 4 to 7 µm Au : 1,5 µm mini
  • Local overplating

Holes and drilling

  • Smallest mechanical drilling : 60 µm (0.8mm long)
  • Ratio Circuit thickness/Drilled diameter until 20
  • Z axis controled drilling : Precision  <25µm